Liquid Metal by CSGR 1g 79 W/m·K* high performance thermal interface for CPU/GPU upgrades. Ultrahigh thermal conductivity compound for serious...

79 W/m·K* thermal conductivity drives exceptional heat transfer from dies and hotspots to copper/nickel coolers, enabling lower core and VRAM temperatures at the same acoustic profile or quieter fans at the same load. Compatible with K5 PRO® thermal putty: build a low-mess, nonconductive wall around the target area to help prevent migration and to fill any surrounding gaps or height variations for a controlled, professional finish. Precision, low-pressure application using the included plastic and needle tips allows drop-by-drop placement under magnification for desktops, gaming laptops, consoles, and small-form-factor systems. Optimized wetting on copper and nickel-plated contacts forms an ultra-thin, continuous interface layer that reduces thermal resistance where standard pastes struggle. Clear usage guidance for safe results: apply sparingly on cleaned, degreased surfaces; avoid aluminum heat sinks; insulate nearby SMDs; verify seating pressure before power-up. Ideal for top tier scenarios such as overclocked desktops, high-power GPUs, dense VRM stages, and compact water cooling blocks where maximizing heat flux matters.