Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks Maximum Thermal Conductivity

Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications. Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity